常備粒徑：1.3-4微米、4-8微米，30-40微米
Size: 1,3-4um. 4-8um.30-40um
用途：可作為導電料漿或導電薄膜等的基礎原料。能大幅度提高導電能力和抗高溫氧化能力，減少接觸電阻、防止高頻擊穿。
Uses: can be used as a conductive material pulp or conductive film base material. Can substantially improve the electrical conductivity and oxidation resistance, reduce contact resistance, prevent high frequency breakdown
化學成份：含銀量0.3-15%，包覆層為純銀，也可為客戶定制特定成份的包覆層。可根據需要選擇粒徑和含銀成份。
Chemical composition: the amount of silver is 0.3-1.5%, coated layer is sterling silver, also can be customized for the specific components of the coating layer. Can choose according to particle size and a silver component.